Solder

Spectrum OverLay through aggregation of heterogeneous DispERsed Bands

Project overview

The goal of SOLDER is to develop a new spectrum overlay technology, which will provide the efficient aggregation of non-continuous dispersed spectrum bands licensed to heterogeneous networks (HetNets) and heterogeneous Radio Access Technology (h-RATs).

Role of IS-Wireless

Within 5GNOW SOLDER IS-Wireless was responsible for radio resource management, scheduler implementation and MAC layer design implementation and system-level simulations.

Main contributors

Design of Carrier Aggregation scheduler for LTE. THe scheduler got integrated with the branch of the popular SDR-based OpenAirInterface LTE stack from Eurecom. The scheduler allows for parametrization of objectives (maximizing throughput, fairness, minimizing latency). The scheduler has been described here

  1. D2.1 Carrier Aggregation over HetNets and h-RATs: Objectives, Scenarios and Requirements More info

  2. D2.2 Component-level requirements for scenarios and use cases More info

  3. D2.3 System-Level Requirements for Scenarios and Use Cases More info

  4. D3.1 Initial report of heterogeneous Carrier Aggregation in LTE-A and Beyond More info

  5. D3.2 Innovative solution for Carrier Aggregation in h-RATs, LTE-A and Beyond More info

  6. D3.3 Final report, Carrier aggregation in h-RATs: PHY, and system results More info

  7. D4.1 PoC Scenarios and system interfaces More info

  8. D4.2 PoC Scenarios and system interfaces More info

  9. D4.3 Experimental analysis of the integrated SOLDER system More info

Design of Carrier Aggregation scheduler for LTE. THe scheduler got integrated with the branch of the popular SDR-based OpenAirInterface LTE stack from Eurecom. The scheduler allows for parametrization of objectives (maximizing throughput, fairness, minimizing latency). The scheduler has been described here

  1. D2.1 Carrier Aggregation over HetNets and h-RATs: Objectives, Scenarios and Requirements More info

  2. D2.2 Component-level requirements for scenarios and use cases More info

  3. D2.3 System-Level Requirements for Scenarios and Use Cases More info

  4. D3.1 Initial report of heterogeneous Carrier Aggregation in LTE-A and Beyond More info

  5. D3.2 Innovative solution for Carrier Aggregation in h-RATs, LTE-A and Beyond More info

  6. D3.3 Final report, Carrier aggregation in h-RATs: PHY, and system results More info

  7. D4.1 PoC Scenarios and system interfaces More info

  8. D4.2 PoC Scenarios and system interfaces More info

  9. D4.3 Experimental analysis of the integrated SOLDER system More info